Guide Advanced Applns of Rapid Prototyping Tech. in Modern Engineering

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ISBN 13: 9789533076980

RP technology has no longer been only for prototype building rather has been extended for real industrial manufacturing solutions. Today, the RP technology has contributed to almost all engineering areas that include mechanical, materials, industrial, aerospace, electrical and most recently biomedical engineering.

1. Introduction

This book aims to present the advanced development of RP technologies in various engineering areas as the solutions to the real world engineering problems. By Takuma Nakano and Fumihito Arai. By Kentaro Iwami and Norihiro Umeda. By Olszewski Raphael and Reychler Herve. By Tiago M. Escudero and Luis Castedo. This is made possible by the EU reverse charge method. Edited by Md Enamul Hoque. Edited by Bishnu Pal. Levy G.


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Rasalkar D. Bagaria S. Ilyas J. In Tech Klocke F. Das S. Hauser C. Badrossamay M. IoT depends on stable internet connection and sensors for data acquisition and transfer. It has enabled companies to create drastically reduce the cost and time to create a product prototype. Now, printed electronics is the next big thing that gets PCB designers excited. It involves the use of electronic ink, to create conductive traces on a substrate with the use of 3D printers. This allows PCB designers to reduce product development time.

Medical rapid prototyping applications and methods | Emerald Insight

However, PCB designers need to be aware of the key differences between printed electronics and those fabricated by PCB vendors. Flex-PCB has become increasingly common, especially in consumer electronics. Designing on a flex-PCB requires a new approach. Considerations must be given to the layer stackups and how to prevent mechanical stress from wearing out the traces.

Not only do PCB get smaller, but the speed they are designed for increased dramatically. Issues like propagation delay become pronounced in high-speed design, and PCB designers need to be skilled in impedance control on the PCB. Electromagnetic Interference EMI has always been a culprit for technical issues on prototypes and deployed electronics units.